Dirk Vandevelde : rechercher sur Z-Library

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1

In Search of Evidence-Based Treatment in TCs for Addictions: 40 Years of Research in TC De Kiem (Belgium)

Vanderplasschen, Wouter, Vandevelde, Stijn, De Ruysscher, Clara, Vandevelde, Dirk, Broekaert, Eric

Journal:

Journal of Groups in Addiction & Recovery

Année:

2017

Langue:

english

Fichier:

PDF, 1015 KB

english, 2017

2

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Vandevelde, Bart, Beyne, Eric, Zhang, Kouchi (G.Q.), Caers, Jo, Vandepitte, Dirk, Baelmans, Martine

Journal:

Journal of Electronic Packaging

Année:

2003

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2003

3

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Baelmans, Martine

Journal:

Journal of Electronic Packaging

Année:

2004

Langue:

english

Fichier:

PDF, 424 KB

english, 2004

4

Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling

Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, Vandepitte, Dirk

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2017

Langue:

english

Fichier:

PDF, 1.79 MB

english, 2017

5

Modified micro–macro thermo-mechanical modelling of ceramic ball grid array packages

Bart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte, Martine Baelmans

Journal:

Microelectronics Reliability

Année:

2003

Langue:

english

Fichier:

PDF, 891 KB

english, 2003

6

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Chukwudi Okoro, Riet Labie, Kris Vanstreels, Alexis Franquet, Mario Gonzalez, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Bert Verlinden

Journal:

Journal of Materials Science

Année:

2011

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2011

7

Eric Broekaert (1951-2016): the life and legacy of a TC pioneer and integrative thinker

Vanderplasschen, Wouter, Vandevelde, Stijn, D'Oosterlinck, Franky, Vandevelde, Dirk, Naert, Jan, Yates, Rowdy, Winship, Gary, Vanderplasschen, Wouter

Journal:

Therapeutic Communities The International Journal of Therapeutic Communities

Année:

2017

Langue:

english

Fichier:

PDF, 439 KB

english, 2017

8

An experimental study on the impact of cinema theater reflections on users’ perceived intra-frame dynamic range

Vyvey, Tine, Castellar, Elena Núñez, Maes, Dirk, Vandevelde, Bruno, Van Looy, Jan

Journal:

Quality and User Experience

Année:

2018

Langue:

english

Fichier:

PDF, 931 KB

english, 2018

9

The contribution of genes involved in potassium-recycling in the inner ear to noise-induced hearing loss

Lut Van Laer, Per-Inge Carlsson, Natacha Ottschytsch, Marie-Louise Bondeson, Annelies Konings, Ann Vandevelde, Nele Dieltjens, Erik Fransen, Dirk Snyders, Erik Borg, Adam Raes, Guy Van Camp

Journal:

Année:

2006

Langue:

english

Fichier:

PDF, 255 KB

english, 2006

10

Molecular Identification of Foreign Inclusions in Inflammatory Tissue Surrounding Metal Implants by Fourier Transform Laser Microprobe Mass Spectrometry

Sonja De Nollin, Katrien Poels, Luc Van Vaeck, Nora De Clerck, Annette Bakker, Valérie Duwel, Dirk Vandevelde, Eric Van Marck

Journal:

Pathology - Research and Practice

Année:

1997

Langue:

english

Fichier:

PDF, 4.88 MB

english, 1997

11

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Finite element modeling of solder joint fatigue in four-point bending test

Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, Vandepitte, Dirk, De Wolf, Ingrid

Année:

2012

Langue:

english

Fichier:

PDF, 2.70 MB

english, 2012

12

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Insertion bonding: A novel Cu-Cu bonding approach for 3D integration

Okoro, Chukwudi, Agarwal, Rahul, Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, Beyne, Eric

Année:

2010

Langue:

english

Fichier:

PDF, 1.80 MB

english, 2010

13

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology

Okoro, Chukwudi, Gonzalez, Mario, Vandevelde, Bart, Swinnen, Bart, Eneman, Geert, Verheyen, Peter, Beyne, Eric, Vandepitte, Dirk

Année:

2007

Langue:

english

Fichier:

PDF, 6.61 MB

english, 2007

14

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, Verlinden, Bert

Année:

2009

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2009

15

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading

Limaye, Paresh, Labie, Riet, Vandevelde, Bart, Vandepitte, Dirk, Verlinden, Bert

Année:

2007

Langue:

english

Fichier:

PDF, 834 KB

english, 2007

16

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture

Okoro, Chukwudi, Gonzalez, Mario, Vandevelde, Bart, Swinnen, Bart, Eneman, Geert, Stoukatch, Serguei, Beyne, Eric, Vandepitte, Dirk

Année:

2007

Langue:

english

Fichier:

PDF, 6.00 MB

english, 2007

17

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Low-Temperature Embrittlement of Lead-Free Solders in Joint Level Impact Testing

Limaye, Paresh, Maurissen, Wout, Lambrinou, Konstantina, Duflos, Frederic, Vandevelde, Bart, Allaert, Bart, Hillaert, Joost, Vandepitte, Dirk, Verlinden, Bert

Année:

2007

Langue:

english

Fichier:

PDF, 3.49 MB

english, 2007

18

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Okoro, Chukwudi, Vanstreels, Kris, Labie, Riet, Lühn, Ole, Vandevelde, Bart, Verlinden, Bert, Vandepitte, Dirk

Journal:

Journal of Micromechanics and Microengineering

Année:

2010

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2010

19

Hepatic Bile Duct Hamartomas (von Meyenburg Complexes): MR and MR Cholangiography Findings

Mortelé, Bart, Mortelé, Koenraad, Seynaeve, Patrick, Vandevelde, Dirk, Kunnen, Marc, Ros, Pablo R.

Journal:

Journal of Computer Assisted Tomography

Année:

2002

Langue:

english

Fichier:

PDF, 975 KB

english, 2002

20

Geen kinderspel

Vanderplasschen, Wouter, Van Rompaye, Evelien, Littera, Luca, Vandevelde, Dirk

Journal:

Année:

2015

Langue:

dutch

Fichier:

PDF, 1.16 MB

dutch, 2015

21

Villa Voortman: carte blanche or not?

Aslan and Dr Rowdy Yates, Laura, Vandevelde, Stijn, De Maeyer, Jessica, De Ruysscher, Clara, Bryssinck, Dirk, Meesen, Dirk, Vanderstraeten, Johan, Broekaert, Eric

Journal:

Therapeutic Communities The International Journal of Therapeutic Communities

Année:

2015

Langue:

english

Fichier:

PDF, 202 KB

english, 2015

22

[IEEE SMPTE 2016 Annual Technical Conference and Exhibition - Los Angeles, CA (2016.10.25-2016.10.27)] SMPTE 2016 Annual Technical Conference and Exhibition - The Perceived Intra-Frame Dynamic Range in a Cinema Environment

Maes, Dirk, Vyvey, Tine, Van Looy, Jan, Vandevelde, Bruno, Stojmenovik, Goran

Année:

2016

Langue:

english

Fichier:

PDF, 862 KB

english, 2016

23

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Okoro, Chukwudi, Huyghebaert, Cedric, Van Olmen, Jan, Labie, Riet, Lambrinou, Konstantza, Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Année:

2010

Langue:

english

Fichier:

PDF, 2.12 MB

english, 2010

24

Reflections on a Service User Perspective in Supporting Persons with Dual Diagnosis: the Case of Villa Voortman

Vandevelde, Stijn, Vander Laenen, Freya, De Ruysscher, Clara, Bryssinck, Dirk, De Maeyer, Jessica, Meesen, Dirk, Broekaert, Eric

Journal:

International Journal of Mental Health and Addiction

Année:

2017

Langue:

english

Fichier:

PDF, 360 KB

english, 2017

25

A non-hydrocephalic goat experimental model to evaluate a ventriculosinus shunt

Vandersteene, Jelle, Baert, Edward, Schauvliege, Stijn, Vandevelde, Kimberley, Dewaele, Frank, De Somer, Filip, Van Roost, Dirk

Journal:

Laboratory Animals

Année:

2018

Langue:

english

Fichier:

PDF, 709 KB

english, 2018